As industrial automation, medical imaging, and edge AI applications continue to demand higher computing density within compact form factors, embedded system designers increasingly require modules that combine high CPU performance, advanced graphics, and dedicated AI acceleration.
Addressing these requirements, SolidRun has introduced a new COM Express Type 6 Compact module powered by the AMD Ryzen Embedded 8840U processor. The module delivers up to 39 TOPS of aggregate AI performance, positioning it as a strong platform for intelligent edge and industrial workloads.
At the heart of the module is the AMD Ryzen Embedded 8840U, built on AMD’s Zen 4 CPU architecture. The processor integrates 8 cores and 16 threads, offering a base frequency of 3.3 GHz and boost clocks up to 5.1 GHz. This configuration provides ample headroom for parallel industrial control tasks, real-time data processing, medical image analysis, and AI inference at the edge.
Graphics processing is handled by the integrated AMD Radeon 780M GPU, based on the RDNA 3 architecture. With 12 Compute Units operating at up to 2.7 GHz, the GPU supports hardware-accelerated video processing and graphics-intensive workloads, making the module suitable for visualization, human–machine interfaces (HMI), and multi-display systems.
AI Acceleration Capabilities
A key differentiator of the Ryzen Embedded 8840U platform is its heterogeneous AI architecture. The processor integrates AMD XDNA™ technology, providing a dedicated Neural Processing Unit (NPU) capable of up to 16 TOPS. When combined with GPU-based AI acceleration, the total AI compute capability reaches 39 TOPS.
This level of performance enables low-latency, on-device AI processing for applications such as machine vision, anomaly detection, predictive maintenance, and intelligent sensor fusion—without reliance on cloud connectivity.
Memory and Storage Architecture
The module supports high-capacity, high-bandwidth memory configurations to accommodate data-intensive workloads and complex software stacks.
| Memory Specification | Details |
|---|---|
| Memory Type | DDR5 SO-DIMM |
| Memory Speed | Up to DDR5-5600 |
| ECC Support | Optional (platform-dependent) |
| Maximum Capacity | 128 GB (2 × SO-DIMM) |
For storage, the module integrates both high-speed and legacy interfaces:
| Storage Interface | Specification |
|---|---|
| M.2 Slot | M.2 Key M (2280), PCIe Gen4 x2 NVMe |
| SATA | 2 × SATA III (6 Gbps) |
This flexible storage configuration supports fast boot times, high-throughput data logging, and compatibility with existing industrial storage solutions.
Expansion and Connectivity
The module complies fully with the COM Express Type 6 standard and uses dual 220-pin board-to-board connectors, enabling scalable system integration and long-term platform stability.
| Interface | Specification |
|---|---|
| PCI Express | PCIe Gen4, up to 16 lanes |
| Ethernet | 1 × 2.5 GbE (Intel i226 controller) |
The PCIe interface allows direct integration of high-bandwidth peripherals such as frame grabbers, AI accelerators, industrial I/O cards, or network adapters.
Display and USB Support
Designed for visualization-heavy environments, the module supports multiple display outputs and a comprehensive USB configuration.
| Display Interface | Details |
|---|---|
| DisplayPort | Up to 4 × DisplayPort |
| Embedded Display | eDP (default) or LVDS |
| USB Interface | Specification |
|---|---|
| USB 3.2 Gen 2 | 1 × 10 Gbps |
| USB 3.0 | 3 × 5 Gbps |
| USB 2.0 | 4 × ports |
These interfaces support a wide range of peripherals, including high-speed cameras, touch displays, storage devices, and industrial input hardware.
Security, Management, and Environmental Specifications
To meet industrial and medical deployment requirements, the module integrates hardware-based security and remote management features.
| Feature | Description |
|---|---|
| Security | Discrete TPM 2.0 (dTPM) |
| Remote Management | BMC support for monitoring and control |
Environmental robustness is designed for demanding operating conditions:
| Parameter | Specification |
|---|---|
| Operating Temperature (Module) | -40°C to +85°C (excluding CPU) |
| CPU Junction Temperature | 0°C to +105°C |
| Operating Humidity | 10% to 90% RH (non-condensing) |
Optional heat spreaders and fanless thermal solutions are available to support deployment in sealed or vibration-sensitive environments.
Software Support and Evaluation Platform
SolidRun provides software support for both Windows and Linux, ensuring compatibility with widely used embedded operating systems and development frameworks.
For evaluation and early development, SolidRun offers the HoneyComb Ryzen R8000 Mini-ITX carrier board, which exposes additional system interfaces and simplifies prototyping.
| Carrier Board Features | Details |
|---|---|
| Ethernet | 2 × 2.5 GbE RJ45 |
| PCI Express | PCIe x16 slot (8 lanes active) |
| Storage | 2 × SATA, 1 × M.2 PCIe Gen4 x4 |
| Expansion Headers | USB, GPIO, PWM, fan control |
| Power Input | Standard ATX connector |
SolidRun has announced that the Ryzen Embedded 8840U COM Express Type 6 module is launching soon, with pricing to be disclosed at a later date.
The module expands SolidRun’s Ryzen Embedded 8000 product lineup and complements existing platforms such as the Bedrock R8000 industrial PC. Within the broader COM Express ecosystem, it competes with solutions like the congatec conga-TCR8, offering a balanced combination of CPU performance, integrated AI acceleration, and industrial-grade reliability for next-generation embedded systems.
