Building on the success of the EPYC Embedded 9005 family, AMD has introduced the EPYC Embedded 2005 Series—a mid-range embedded processor lineup based on the latest Zen 5 CPU architecture. Designed specifically for space-constrained networking, storage, and industrial edge systems, this series delivers a balance of enterprise-class performance, compact integration, and long-term platform stability.
The EPYC Embedded 2005 Series targets applications that require continuous operation, deterministic performance, and extended product lifecycles, making it well suited for embedded deployments with strict reliability and thermal constraints.
The EPYC Embedded 2005 Series consists of three SKUs, covering a wide range of embedded workloads. Configurable TDP values range from 45 W to 75 W, allowing system designers to tune performance and power consumption based on deployment requirements.
All models integrate dual-channel DDR5 memory, PCIe Gen5 connectivity, and enterprise-grade security and reliability features typically reserved for full-scale server platforms.
Processor Specifications
| Feature | EPYC Embedded 2435 | EPYC Embedded 2655 | EPYC Embedded 2875 |
|---|---|---|---|
| CPU Architecture | Zen 5 | ||
| Die Configuration | 1 CCD + 1 IOD | 1 CCD + 1 IOD | 2 CCDs + 1 IOD |
| Cores / Threads | 8 C / 16 T | 12 C / 24 T | 16 C / 32 T |
| Base / Boost Frequency | 2.8 GHz / up to 4.5 GHz | 2.7 GHz / up to 4.5 GHz | 3.0 GHz / up to 4.5 GHz |
| L2 Cache | 8 MB | 12 MB | 16 MB |
| L3 Cache | 32 MB | 64 MB | 64 MB |
| Memory Support | Dual-channel DDR5-5600 (1 DIMM per channel) or DDR5-3600 (2 DIMMs per channel), sideband ECC | ||
| PCIe Support | 28 × PCIe Gen5 lanes, 11 root ports, SR-IOV, enhanced hot-plug | ||
| USB | 4 × USB 3.2 Gen 2 (10 Gb/s), 1 × USB 2.0 | ||
| Platform Interfaces | GPIO, I²C, I³C, SMBus, SPI, eSPI | ||
| Security Processor | Integrated AMD Security Processor | ||
| Default TDP | 45 W | 55 W | 75 W |
| Configurable TDP Range | 45–55 W | 45–75 W | 45–75 W |
| Package | FL1 lidless BGA, 40 × 40 × 2.13 mm, 0.81 mm ball pitch, 1,763 balls | ||
| Socket | Single-socket SoC | ||
| Operating Junction Temperature | 0°C to 105°C | ||
Compact Chiplet Design with Enterprise-Class Capabilities
A defining characteristic of the EPYC Embedded 2005 Series is its ultra-compact 40 × 40 mm lidless BGA package, significantly smaller than traditional enterprise server processors. This compact footprint enables high-density system designs and makes the platform suitable for installations where board space is limited.
Internally, the processors use AMD’s chiplet architecture, combining:
- 4 nm Core Complex Dies (CCDs) for compute workloads
- 6 nm I/O Dies (IODs) for memory, PCIe, and system connectivity
The thin 2.13 mm package profile supports direct-die cooling, enabling fanless, sealed, or ruggedized system designs—an essential requirement for industrial, aerospace, and edge deployments exposed to vibration, dust, or extended temperature ranges.
Despite its small form factor, the EPYC Embedded 2005 Series integrates a full set of enterprise features, including:
- Advanced RAS (Reliability, Availability, and Serviceability)
- BMC integration support
- PCIe hot-plug capability
- Multi-SPI ROM support
- AMD Infinity Guard security technologies
This marks the first time that a complete EPYC-class feature set has been delivered in a processor optimized specifically for embedded applications.
Target Applications and Deployment Scenarios
With up to 16 Zen 5 cores, 32 threads, 64 MB of L3 cache, and 28 lanes of PCIe Gen5 connectivity, the EPYC Embedded 2005 Series is well suited for performance-critical edge workloads, including:
- Networking Equipment: High-throughput routers, firewalls, and network appliances
- Storage Systems: Cold storage, NVMe-based edge storage, and data aggregation nodes
- Aerospace and Robotics: Mission-critical systems requiring deterministic performance and continuous uptime
- Industrial Edge Computing: Rugged controllers for manufacturing, transportation, and energy infrastructure
AMD further strengthens the platform’s value proposition with a guaranteed 10-year product availability, ensuring long-term supply continuity for embedded designs with extended production and support lifecycles.
The EPYC Embedded 2005 Series is compatible with standard embedded software ecosystems, including:
- EDK II firmware implementations
- Yocto-based Linux distributions
- Upstream Linux kernel drivers
Early access silicon is currently sampling with selected partners. While detailed technical documentation has not yet been fully published through AMD’s Technical Information Portal, broader software resources are expected to follow closer to general availability.
Mass production is planned for Q1 2026. Pricing has not been publicly disclosed at this stage.
