TechNexion has introduced two new system-on-modules (SoMs) powered by the Synaptics SL2610 processor: the AIOM-SL2610 (SO-DIMM form factor) and the OSM-SL2610 (OSM Size S).
Both share identical processing and security architectures but are tailored for different embedded applications — the AIOM-SL2610 for modular and interface-rich systems, and the OSM-SL2610 for space-constrained, soldered designs.
TechNexsion AIOM-SL2610 SO-DIMM system-on-module
The AIOM-SL2610 adopts a 260-pin SO-DIMM CPU module design, integrating the Realtek RTL8211F Gigabit Ethernet PHY, Wi-Fi 6, and Bluetooth 5.3 connectivity, as well as an onboard JTAG debug interface. It targets embedded solutions requiring rich I/O expansion.
The OSM-SL2610, on the other hand, is a solderable module that strictly follows the OSM Size S specification, optimized for compact and industrial environments.
Common hardware configuration:
- Memory: Up to 2GB LPDDR4
- Storage: Up to 64GB eMMC flash
- Security: Supports Arm PSA Certified Level 2 or Level 3
AIOM-SL2610 (SO-DIMM) — Detailed Specifications
The AIOM-SL2610 is designed for developers who need flexible interface options and industrial reliability. Its specifications are summarized below:
| Category | Specification |
|---|---|
| SoC | Synaptics SL2610 series (options: SL2613, SL2617, SL2619) |
| Application Cores | Single or dual Arm Cortex-A55 cores up to 2.0 GHz |
| Real-Time Core | Arm Cortex-M52 with Helium SM domain, 256KB SRAM |
| GPU | Optional Arm Mali-G31 3D graphics engine |
| NPU | Optional Torq or Coral ML engine (RISC-V core), up to 1 TOPS AI performance |
| Memory | Up to 1GB DDR3L or 2GB LPDDR4 |
| Storage | 32GB or 64GB eMMC; SDIO interface supported |
| Display Interface | MIPI DSI |
| Camera Interface | MIPI CSI-2 |
| Audio | I2S digital audio bus |
| Networking | 1× Realtek RTL8211F GbE PHY; 1× Synaptics SYN4612 Wi-Fi 6 + Bluetooth 5.3 (MHF4 antenna connector); dual Gigabit Ethernet via RTL8211 + RGMII |
| USB | 2× USB 2.0 ports |
| Other Interfaces | CAN bus, UART, SPI, I2C, I3C, PWM, GPIO |
| Analog Interface | ADC (Analog-to-Digital Converter) |
| Debug | Onboard JTAG via through-hole pins |
| Security | PSA Level 2 (SL2613/2617) or Level 3 (SL2619) |
| Power Management | 5V DC input; PMIC: MPS5479 |
| Dimensions / Weight | 69.6 × 35 mm; ≤12 g |
| Operating Temperature | Commercial: 0°C–60°C; Industrial: -40°C–85°C |
| Humidity | 10%–90% (non-condensing) |
| MTBF | 50,000 hours |
| Shock Resistance | 15G half-sine, 11ms duration |
| Vibration Resistance | 1 Grms, 5–500Hz, 1 hour per axis |
The AIOM-SL2610 supports Yocto Linux BSP and Debian, covering most embedded development environments.
TechNexion also provides the Devkit-SL2610 evaluation board, featuring HDMI, dual USB 2.0 ports, Gigabit Ethernet (RJ45), and a 40-pin GPIO header.
While TechNexion has not yet announced the commercial release date or pricing, the module will benefit from a 15+ year product lifecycle. The Synaptics SL2610 SoC itself is already sampling, with volume production planned for Q2 2026.
OSM-SL2610 (OSM Size S) — Detailed Specifications
The OSM-SL2610 is a compact, solderable alternative to the AIOM variant, adhering to OSM Size S (30×30 mm) specifications. It delivers similar performance in a smaller footprint.
| Category | Specification |
|---|---|
| SoC | Synaptics SL2610 series (SL2613 / SL2617 / SL2619) |
| Application Cores | Single or dual Arm Cortex-A55 up to 2.0 GHz |
| Real-Time Core | Arm Cortex-M52 with Helium SM domain, 256KB SRAM |
| GPU | Optional Arm Mali-G31 |
| NPU | Optional Torq/Coral ML engine (RISC-V), up to 1 TOPS |
| Memory | Up to 1GB DDR3L or 2GB LPDDR4 |
| Storage | 32GB or 64GB eMMC; SDIO supported |
| Pin Count | 332 pins |
| Display Interface | MIPI DSI |
| Camera Interface | MIPI CSI-2 |
| Audio | I2S |
| Networking | Dual Gigabit Ethernet via RGMII |
| USB | 2× USB 2.0 |
| Other Interfaces | CAN, UART, SPI, I2C, I3C, PWM, GPIO |
| Analog Interface | ADC |
| Debug | JTAG supported |
| Security | PSA Level 2 / 3 (depending on SoC model) |
| Power Management | 5V DC input; PMIC: MPS5479 |
| Dimensions / Weight | 30 × 30 mm; ≤3 g |
| Operating Temperature | Commercial: 0°C–60°C; Industrial: -40°C–85°C |
| Humidity | 10%–90% |
| MTBF | 50,000 hours |
| Shock Resistance | 15G, 11ms |
| Vibration Resistance | 1 Grms, 5–500Hz, 1 hour per axis |
| Certifications | CE, FCC, RoHS, REACH |
Currently, TechNexion has not released a dedicated OSM development kit, but the Devkit-SL2610 can be used for both evaluation and early firmware bring-up.
Both modules share identical BSP and OS support (Yocto, Debian) and are designed for long-term industrial availability, expected to match the 15-year lifecycle of the AIOM variant.
Core Comparison — AIOM-SL2610 vs OSM-SL2610
| Feature | AIOM-SL2610 (SO-DIMM) | OSM-SL2610 (OSM Size S) |
|---|---|---|
| Form Factor | 260-pin SO-DIMM, pluggable module | Solderable OSM Size S module |
| Dimensions / Weight | 69.6 × 35 mm, ≤12 g | 30 × 30 mm, ≤3 g |
| Pin Count | 260 (SO-DIMM standard) | 332 pins |
| Networking | Dual GbE + Wi-Fi 6 + Bluetooth 5.3 | Dual GbE only (RGMII) |
| Debug Interface | JTAG via through-hole pins | Standard JTAG support |
| Certifications | Not specified | CE, FCC, RoHS, REACH |
| Development Kit | Dedicated Devkit-SL2610 available | Compatible with Devkit-SL2610 |
